Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival—perhaps surpass—the societal impact of integrated circuits.
- Microelectromechanical Systems
- Copyright
- Acknowledgments
- Preface
- Contents
- Acronyms
- Executive Summary
- LEVERAGING AND EXTENDING THE INTEGRATED CIRCUITS FOUNDATION
- ENLARGING THE SUITE OF MATERIALS SUITABLE FOR INTEGRATED-CIRCUIT-LIKE PROCESSING
- CHARACTERIZING MEMS MATERIALS
- UNDERSTANDING SURFACE AND INTERFACE EFFECTS
- ETCHING TECHNOLOGIES
- ESTABLISHING STANDARD TEST DEVICES AND METHODS
- MEMS PACKAGING
- FOUNDRY AND COMPUTER-AIDED DESIGN INFRASTRUCTURE FOR MEMS
- ACADEMIC STRUCTURE TO SUPPORT MEMS
- 1 Background
- COMMERCIAL SUCCESSES
- Thermal Ink-Jet Printing
- Accelerometers
- NEWLY INTRODUCED PRODUCTS
- High-Resolution Displays
- Chemical-Sensing Arrays
- LONGER-RANGE OPPORTUNITIES
- Transportation
- Biomedical and Health Care
- Information Technology
- Defense
- SUMMARY
- 2 Integrated Circuit-Based Fabrication Technologies and Materials
- STRENGTHS OF THE INTEGRATED CIRCUIT PROCESS
- USING EXISTING INTEGRATED CIRCUIT-BASED PROCESSES
- Bulk Micromachining Processes
- Bulk Micromachining for MEMS with Electronics
- Surface Micromachining Processes
- Surface Micromachining to Produce Multilevel MEMS
- CLASSIFYING INTEGRATED CIRCUIT-BASED TECHNOLOGIES
- MEMS with Old Materials and Old Tools
- MEMS with Old Materials and New Tools
- MEMS with New Materials and Old Tools
- MEMS with New Materials and New Tools
- SUMMARY
- 3 New Materials and Processes
- MOTIVATIONS FOR NEW TECHNOLOGIES
- MATERIALS AND PROCESSES FOR HIGH-ASPECT-RATIO STRUCTURES
- HEXSIL
- LIGA
- Compatibility and Manufacturing Constraints of LIGA
- MATERIALS AND PROCESSES FOR ENHANCED-FORCE MICROACTUATION
- Materials
- Magnetic Thin-Films
- Piezoelectric Films
- Shape-Memory Alloys
- Shape-Memory Polymers
- Magnetostrictive Alloys
- Processing
- Processing Multilayer Ceramics
- Thin-Film Processing
- FILMS FOR USE IN SEVERE ENVIRONMENTS: SILICON CARBIDE AND DIAMOND
- SURFACE MODIFICATIONS/COATINGS
- Plasma-Deposited Polymers
- Polyimides
- Conducting Polymers
- POWER SUPPLIES
- SUMMARY
- 4 Designing Microelectromechanical Systems
- METROLOGY
- MODELING
- COMPUTER-AIDED DESIGN SYSTEMS
- FOUNDRY INFRASTRUCTURE
- SUMMARY
- 5 Assembly, Packaging, and Testing
- CONTRASTS BETWEEN ASSEMBLY, PACKAGING, AND TESTING OF INTEGRATED CIRCUITS AND MICROELECTROMECHANICAL...
- INTERFACES
- Biomedical Interfaces
- Optical Interfaces
- Electrical Power
- Fluidics
- Mechanical Interfaces
- PACKAGING
- Handling Issues
- Dicing
- Cleanliness
- Stiction
- Packaging Materials
- Stresses on Packaging
- Fluid Environment
- Vacuum Packaging
- ASSEMBLY
- Hybrid Assembly
- Assembly of Micromechanical Parts
- STANDARDS, TESTING, AND RELIABILITY
- FAILURE ANALYSIS
- SUMMARY
- References
- APPENDICES
- Appendix A World Wide Web Sites on MEMS
- Appendix B Biographical Sketches of Committee Members
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