Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection

  • Publisher: National Academies Press
  • ISBN: 9780309042338
  • eISBN Pdf: 9780309536691
  • Place of publication:  United States
  • Year of digital publication: 1990
  • Month: January
  • Pages: 154
  • Language: English
  • Cover
  • FRONT MATTER
  • EXECUTIVE SUMMARY
  • 1 INTRODUCTION
  • 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS
  • 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS
  • 4 MATERIALS ISSUES
  • 5 SOME SPECIFIC MATERIALS
  • 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES
  • APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT
  • APPENDIX B: SOME INDUSTRY COMPONENT DATA
  • APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS
  • APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES
  • APPENDIX E: MATERIALS PROPERTIES
  • APPENDIX F: EXAMPLES OF MULTICHIP MODULES
  • APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS

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