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Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection

Editor: National Academies Press
ISBN: 9780309042338
eISBN Pdf: 9780309536691
Lugar de publicación: Estados Unidos
Año de publicación digital: 1990
Mes: Enero
Páginas: 154
Idioma: Ingles

Cover
FRONT MATTER
EXECUTIVE SUMMARY
1 INTRODUCTION
2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS
3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS
4 MATERIALS ISSUES
5 SOME SPECIFIC MATERIALS
6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES
APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT
APPENDIX B: SOME INDUSTRY COMPONENT DATA
APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS
APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES
APPENDIX E: MATERIALS PROPERTIES
APPENDIX F: EXAMPLES OF MULTICHIP MODULES
APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS

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